Precision Thermal Management Solutions for Electronics & High-Performance Systems
About T‑Global Technology Co., Ltd.
Founded in 2003 and headquartered in Taoyuan, Taiwan, T‑Global Technology is a leading specialist in thermal management materials and systems. Operating globally with production facilities in Taiwan and the UK, plus branches in the US, UK, Japan, Korea, China and Vietnam, the company provides rapid prototyping, simulation and fully customized thermal solutions with low MOQ and short lead times.
Their product lineup supports high-demand sectors including servers, AI computing, EV, energy storage, 5G, robotics and medical equipment.
Product Categories
Design Consultancy & Engineering Support
At McKinsey Electronics, we collaborate with T‑Global to deliver tailored thermal solutions:
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Thermal Simulation & Material Selection: Analyze system layouts to determine optimal thermal interface materials and heat-spreading structures.
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Prototyping & Performance Testing: Rapid sample delivery and testing across temperature/load scenarios.
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Customized Integration Services: Design support for vapor chambers, AlSiC plates and integrated fans within system architecture.
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Global Compliance & Support Network: Local engineering support across Taiwan, US, EU, Japan, Korea, China and Vietnam for seamless project execution.
Why Choose McKinsey Electronics
01
Thermal Engineering Leadership: Deep expertise in thermal materials and design, aligned with T‑Global’s innovation.
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Global Reach & Local Support: Multi-region presence ensuring sample delivery and integration support worldwide.
03
Acceleration to Market: Prototyping speeds and low MOQs shorten development cycles.
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Customization & Quality: Collaborative design process from simulation to supply, with UL, RoHS, IECQ certifications
Let’s Build the Future Together
Facing thermal challenges in high-power, densified or mission-critical electronics?
Contact McKinsey Electronics today to explore how T‑Global’s thermal platform, engineered with our integration and simulation support, can enhance reliability and performance in your next system.
Recent Products
T‑Global TG‑L37‑3S
Ultra-soft thermal gap filler designed for LCD, SSD and board-level interfaces; ideal for thin-tolerance applications requiring efficient conduction.
TG‑A9000 Series
Ultra-soft silicone pads with varying thickness and high thermal conductivity; suitable for CPUs, GPU modules and memory devices on motherboards
TG‑NSP‑35 Non‑Silicone Putty
Robust thermal compound for flexible component profiles, compatible with EMI shielding and optical electronics integration.
Featured Product Categories
Thermal Pads & Gap Fillers
Soft materials (e.g., TG‑L37‑3S) for tight-contact heat conduction in compact systems.
Silicone/Non-silicone Putty & Tapes
Adaptive materials (e.g., TG‑NSP‑25) for dynamic gaps and multi-height components.
Heat Pipes & Vapor Chamber Modules
Integrated solutions for high-flux thermal requirements in AI and 5G systems.
