Traceable semiconductors via ultra-modern and certified QC lab
External Visual Inspection
The validity of the interior packaging, the humidity indicator, the desiccant requirements, and the suitability of the outside packaging are all confirmed through appearance testing. Additionally, the outward look of a single chip is examined, including the characters and data printed on the chip, such as the year, the country of origin, if it has been re-coated, the condition of the pins, and whether there are any signs of re-grinding or unidentified residues.
Heated Chemical Test
It will be possible to validate and establish through this testing process whether the device has been remarked or resurfaced. Many suppliers exploit slower speed or older date code devices as part of counterfeiting, then they repair them to look brand new and market them as higher-grade electronic components, with a more recent date code, or as RoHS compliant.
Heated Chemical Testing or HCT is mainly used to check for secondary coating. As such, the partially cured resins, paint, blacktop, or secondary coating will degrade if left for a predetermined amount of time. Then, a crisp image is captured under the microscope, to reveal any secondary coatings the device may have had. On a refurbished item, more things might be visible when the coating is removed during this process,
Previous device markings
Exposed sanding marks
Marks of bead blasting
Speed grade rating change from C (Commercial) to I (Industrial)
Masking signs of rips, chips, cracks, or other irregularities
Uncovered bond wires
In the electronics sector, the solderability test is carried out by replicating the welding process and assessing the sample's impact while analyzing the quality of the employed solder paste and flux as well as the soldering process. The purpose of the wetting balance is to quickly wet the sample while measuring the strength of the solder to determine how much force was applied and how long it took for the binding to take place.
The particular sample is put on the fixture and submerged in the solder at the predetermined temperature. To accurately and quantitatively assess the soldering quality, the force and time data are supplied to the computer via the sensor, and the curve and data file are produced via the program.
Examining the integrity of the bonding, layer peeling, void, and burst for integrated circuits (IC) packaging flaws
Potential flaws in the printing of printed circuit boards (PCB), such as poor alignment, bridging, and open circuit
Detection and measurement of the surface-mount technology (SMT) solder joint void phenomenon
Inspection of flaws for possible open circuits, short circuits, or irregular connections in various connecting lines
Solder ball array packing and chip-on-chip packaging integrity inspection
Examining plastic materials with higher densities or metal materials with holes
Measurement of component tin area ratio, wire arc, and chip size
Decapsulation and high magnification analysis are additional tools that McKinsey Electronics utilizes to look for damage on ICs surface, as well as to determine the authenticity and traceability of the DUT. The objective of this operation is to check if the die has been reassembled or repackaged or to see if physical damage or excessive stress caused a functional failure.
Decapsulation is the process of mechanically, thermally, or chemically removing a cap, lid, or encapsulating material from a packed integrated circuit. To enable additional examination, decapsulation is done to get access to a device's package cavity and/or surface. The removal of the lid in the case of a hermetic device enables visual inspection for foreign objects, corrosion, or mechanical harm. The IC surface is also visible when the polymeric encapsulating substance covering the plastic-packaged part is removed.
The inspection consists of running a number of important logic and signal state tests under particular working circumstances as well as when the device is in its default operating state.
Based on the original factory specifications as well as industry standards, this test creates special test circuits or vectors for feasibility, applies the corresponding signal source input to the test samples, and analyses specific conditions like peripheral circuit adjustment and control, signal amplification, or conversion matching. The output waveform's change state and the signal's logic relationship are utilised to determine the device's functional features.
The success of the final product resides in analyzing the steps taken to keep the product functionally reliable in all situations, such as anticipated use, transit, or storage for the course of the stipulated lifespan.
To replicate low and high humidity temperatures as well as temperature changes in the climate, to speed up the product's reaction in the use environment, and to check that it satisfies the standards for quality set forth in research and development, design, and manufacturing. The objective is to assess the product as a whole to determine its dependability and lifespan.