What Circuit Designers Must Master in 2025 to Build Resilient, EMI-Hardened Systems

Read Below:

• EMI is Now Central: Designers must prioritize EMI mitigation through shielding, grounding, and smart layout practices.

• Next-Gen Tools & Materials: AI-driven design, high-density interconnect (HDI) PCBs and photonics are key to performance and resilience.

• McKinsey Electronics Supports Regionally: Based in the UAE, McKinsey Electronics provides top-tier components and engineering support to build EMI-hardened systems.

As we advance into 2025, circuit designers face an increasingly complex landscape. The convergence of high-speed electronics, dense integration and pervasive connectivity has elevated electromagnetic interference (EMI) from a peripheral concern to a central design challenge. Building resilient systems now demands a holistic approach that transcends traditional silicon-focused methodologies.

1. Embracing High-Density Interconnects and Advanced Materials

The push for miniaturization and performance has led to the adoption of HDI designs and advanced materials in PCB manufacturing. HDI PCBs offer compact designs with improved signal integrity, essential for modern applications like smartphones and medical devices. Simultaneously, advanced materials such as high-performance substrates and conductive inks are revolutionizing PCB manufacturing, enabling better thermal and electrical properties.

2. Integrating AI and Machine Learning in Design Automation

Artificial Intelligence (AI) and Machine Learning (ML) are transforming circuit design processes. AI-driven Electronic Design Automation (EDA) tools can optimize layouts, predict EMI issues and suggest mitigation strategies, significantly reducing design cycles and improving reliability. For instance, Synopsys' introduction of AI "agents" aims to assist engineers in complex chip design tasks, enhancing R&D capacity without overwhelming engineering teams.

3. Advancing EMI Mitigation Techniques

Effective EMI mitigation is paramount in ensuring system resilience. Designers must employ a combination of strategies:

• Shielding: Implementing metallic enclosures or PCB-level shielding to contain electromagnetic emissions.

• Grounding: Establishing low-impedance paths to ground for unwanted currents to dissipate, minimizing electromagnetic emissions and interference.

• Filtering: Using filters, such as ferrite beads or low-pass filters, to attenuate high-frequency noise.

• Component Selection: Choosing components with favorable EMI characteristics.

• Careful PCD Design: Reducing the production and spread of EMI inside the circuit board.

These methods, when combined, can significantly reduce EMI and enhance system performance.

4. Prioritizing Power Integrity and Thermal Management

With increasing power densities, maintaining power integrity and managing thermal performance are critical. Techniques such as backside power delivery (BPD) are emerging, relocating power interconnects to the backside of silicon wafers, improving power efficiency and design flexibility. Intel's PowerVia technology exemplifies this trend, offering improved power integrity and reduced signal interference.

5. Leveraging Photonic Integration for High-Speed Data Transfer

Photonic Integrated Circuits (PICs) are gaining traction for their ability to handle high-speed data transfer with lower power consumption. By integrating optical components, PICs can alleviate bandwidth bottlenecks and reduce EMI, making them suitable for applications in data centers and high-performance computing.

6. Implementing Robust PCB Design Practices

PCB layout plays a pivotal role in EMI mitigation and overall system resilience. Key practices include:

• Layer Stack-Up Optimization: Strategically arranging layers to minimize EMI.

• Controlled Impedance Routing: Ensuring signal integrity by maintaining consistent impedance.

• Separation of Analog and Digital Grounds: Preventing noise coupling between different circuit domains, a crucial technique in mixed-signal circuit design.

• Use of Ground Planes: Providing a low-impedance return path for signals.

Adhering to these practices can significantly enhance the electromagnetic compatibility (EMC) of the design.

7. Adopting Sustainable and Resilient Design Approaches

Sustainability is becoming a core consideration in circuit design. Designers are exploring biodegradable PCBs and energy-efficient components to reduce environmental impact. Moreover, building resilience into designs, such as incorporating redundancy and fail-safes, ensures reliability in the face of unforeseen challenges.

In 2025, circuit designers must transcend traditional boundaries, integrating interdisciplinary knowledge and advanced technologies to build resilient, EMI-hardened systems. By embracing innovations in materials, design automation, EMI mitigation, and sustainability, designers can navigate the complexities of modern electronics and deliver robust, future-ready solutions.

Headquartered in Dubai, UAE, McKinsey Electronics offers comprehensive support to engineers and OEMs across Africa, Türkiye and the Middle East. Our extensive line card features top-tier manufacturers specializing in advanced materials, EMI mitigation components and photonic integration technologies. By providing on-ground technical engineering support, we ensure that design teams can effectively implement cutting-edge solutions, aligning with the industry's shift towards high-density interconnects, AI-driven design automation and sustainable practices. This commitment positions McKinsey Electronics as a crucial ally for our partners and designers aiming to meet the complex demands of contemporary electronic systems.