The Future Is Modular: Why Every Engineer Should Understand UCIe and Chiplets
- jenniferg17
- Jul 11
- 3 min read
Updated: Aug 7
Read Below:
Modular Shift: Chiplet-Based architectures are replacing monolithic SoCs, offering improved yield, flexibility and performance by enabling heterogeneous integration of dies.
UCIe Standard: The Universal Chiplet Interconnect Express (UCIe) ensures high-speed, low-latency communication between chiplets, accelerating adoption across data centers, mobile devices and AI systems.
Regional Engineering Support: McKinsey Electronics supports this transition in the ATME region by providing Tier-One components and integration support aligned with UCIe, enabling engineers to build scalable next-generation systems.
The semiconductor industry is shifting from monolithic system-on-chip (SoC) designs to modular, chiplet-based architectures. Central to this evolution is the Universal Chiplet Interconnect Express (UCIe), an open standard that facilitates seamless die-to-die communication within a package. For engineers aiming to stay updated in the electronics design field, a deep understanding of UCIe and chiplet technologies is indispensable.
Why Chiplets?
Traditional SoCs integrate all functionalities onto a single silicon die. While this approach has served well, it faces limitations in terms of scalability, yield and cost, especially as we approach the physical limits of silicon fabrication. Chiplets offer a solution by partitioning a system into smaller, function-specific dies that can be manufactured separately and then integrated into a single package.
Advantages of Chiplet Architectures:
Heterogeneous Integration: Combine dies fabricated using different process nodes, optimizing for performance, power and cost.
Improved Yield: Smaller dies have higher yields, reducing overall manufacturing costs.
Design Flexibility: Mix and match chiplets to create customized solutions for diverse applications.
The Role of UCIe
UCIe standardizes the interface between chiplets, ensuring interoperability and simplifying the integration process. It defines the physical layer, protocol stack and software models necessary for seamless communication between dies.
Key Features of UCIe:
High Bandwidth: Supports data rates suitable for high-performance applications.
Low Latency: Ensures rapid communication between chiplets, critical for real-time processing.
Scalability: Accommodates a range of applications, from consumer electronics to data centers.
The latest UCIe 1.1 specification introduces enhancements such as support for streaming protocols and optimized bump map configurations for cost-effective packaging.
Monolithic vs. Chiplet-Based Architectures
Real-World Applications and Part Numbers
1. AMD EPYC 7003 Series:
AMD's EPYC 7003 series, such as the EPYC 7763, utilizes a chiplet architecture comprising multiple "Zen 3" core dies and a separate I/O die. This design enhances scalability and performance in server environments. The EPYC 7763 features 64 cores and 128 threads, delivering exceptional performance for data center workloads.
2. Intel's Foveros Technology:
Intel's Foveros 3D packaging technology enables the stacking of chiplets vertically, allowing for high-density integration. Products like the Lakefield processor demonstrate this approach, combining different IP blocks in a compact form factor.
3. Qualcomm Snapdragon 888:
The Snapdragon 888 processor employs a chiplet-based design to integrate various functionalities, including CPU, GPU and AI processing units, optimizing performance for mobile applications.
Implications for Engineers
Understanding UCIe and chiplet architectures is crucial for engineers involved in:
System Design: Architecting systems that leverage modular components for flexibility and scalability.
Hardware Integration: Ensuring seamless communication between diverse chiplets within a package.
Performance Optimization: Balancing power, performance and cost by selecting appropriate chiplet combinations.
The transition to chiplet-based architectures, underpinned by standards like UCIe, represents a significant evolution in semiconductor design. For engineers, embracing this modular approach is essential to drive innovation and meet the demands of next-generation applications.
With its presence in key innovation hubs across the ATME region, McKinsey Electronics, headquartered in Dubai, UAE, helps engineering teams in regional markets like Turkey, Africa and the Middle East adapt to the shift toward modular chiplet-based architectures by sourcing Tier-One components that align with UCIe standards. As chiplet adoption accelerates in data centers, AI edge devices and custom SoCs, McKinsey Electronics provides the ecosystem access and technical coordination necessary to support advanced integration strategies across the region. Contact us today.
